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About this event
This technical webinar provides an in-depth look at the challenges and innovations in MEMS pressure die design and sensor assembly across a wide pressure range, spanning from 200 Pa to 2 MPa . It explores key aspects of pressure die design, sensor architecture, and signal processing, highlighting the unique design and manufacturing requirements of pressure sensors operating at extremely low pressures, down to 2 mbar, and how to overcome the associated technical challenges.
Hosted by
Our Group is a leading developer, manufacturer and global supplier of sophisticated component and engineering solutions for more than 20’000 OEM customers in a variety of industries worldwide.
