About this event
AI is moving transportation systems from simply collecting data to understanding what is happening at the edge—and acting on it in real-time. From intelligent vehicles and rail systems to smart infrastructure, airports, and ports, transportation OEMs and ODMs face growing challenges in delivering AI-enabled edge systems that are high-performance, reliable, and deployment-ready.
In this webinar, Intel and congatec will explore how the Intel Core Ultra Series 3 (Panther Lake) processor and congatec Computer-on-Modules enable scalable AI-powered transportation systems. Learn how to address key design challenges - from AI performance, real-time processing, and workload consolidation to thermal management, power efficiency, ruggedness, and system lifecycle - while reducing development effort and accelerating time-to-market.
Through real-world transportation use cases, we will show how Intel and congatec combine advanced silicon and modular computing to help OEMs and ODMs transition from traditional system architectures to a modern, AI-enabled approach - accelerating AI adoption while simplifying system development.
What You'll Learn
Hosted by
Christian Eder is Co-Founder and Director Market Intelligence at congatec, with 30 years of experience in embedded computing. He chairs the PICMG COM-HPC working group, has contributed to the COM Express and SMARC specifications, and serves on the board of SGET. He holds a degree in Electrical Engineering from the University of Applied Sciences Regensburg.
Anthony “Tony” Abuta leads Intel’s work in intelligent transportation infrastructure. With 25+ years spanning engineering and technology strategy, he collaborates with cities, transportation agencies, and industry partners to bring practical edge AI into real-world deployments, improving safety, operations, and mobility.
congatec is a global leader in Computer-on-Modules (COMs), providing high-performance hardware and software for embedded and edge computing across industrial automation, medical technology, robotics, telecommunications, and more.