Heat and powerâtwo of the most critical challenges in PCB design. Â Poor thermal and power management can lead to reduced performance, shorter lifespans, and even system failures. But with the right strategies, you can turn these challenges into opportunities!Â
- Monday 17 March - 6PM CET
- Wednesday 19 March - 3PM CET
- Friday 21 March - 10AM CET
In this webinar, weâll cover:
đĄïž The differences between standard copper, heavy copper and the related cost index.
đ© Innovative solutions like Cu Coins and Cu Inserts that improve heat dissipation locally to enhance critical component performance by lowering the operation temperature.
đ§ How to leverage insulated metal substrates (IMS) for superior thermal management, for LED and other applications.
đ The role of thermal vias and the importance of choosing the right via filling for better heat transfer and improved PCB quality.
đĄ Practical tips for optimizing power distribution and ensuring stable operation.
Whether youâre designing high-power circuits or compact boards with heat challenges, this webinar is your guide to smarter thermal and power strategies.Â
