About this event
PCB design parameters is driven by the component package sizes!
🚀 Based on package size and pitch the new AFNOR Spec 2212 simplifies the design parameter selection process by introducing 10 Routing classes (RC). This enables a fast classification of the designs complexity to the benefit of the complete supply chain from design to final product. Design and Specification is the foundation of cost optimal products with Consistent Quality.
Topics include:
✨ Who is AFNOR and why do the electronic industry need a new standard for Printed Circuit Board design?
✨ Review of the Component-defined design Routing classifications - a game-changer for streamlining design parameters.
✨ The smallest solder joint pad pitch defines the routing density and technology requirement – a new unique and innovative definition.
✨ The 10 defined design classes brings unprecedented clarity and precision to the design process.
✨ The AFNOR aligns with global industry needs while encouraging innovation.
This is your chance to gain insights directly from the experts on the AFNOR design specifications potential to transform design practices. Don’t miss this opportunity to join this round table conversation about PCB design innovation!
Hosted by
Olivier started working for the PCB industry in 1998. During the first 5 years of his career, he was in charge of the PCB Production Workshop. Then has been Method Manager at SAGEM PCB Manufacture, and as an Application Engineer for Complex & Flex PCB. Since then he is working for ICAPE Group since 2014 as PCB Field Application Engineer.
Erik started in the PCB industry in 1989. Starting as a trainee on the production floor, advancing to quality/test and to the pre-production engineering has given him a unique understanding of each production step, combined with theoretical engineering knowledge. This has been the foundation he has used during the years, to be more than just a salesman. For the last 9 years, he has been working as FAE, before he joined ICAPE Group, where he acts as a FAE & Quality Director.
Ron began working in the PCB industry in 1984 after graduating from Anderson College. He started his career with a mid-sized PCB manufacturer as a manufacturing engineer and manager of their proto lab. Subsequently, Ron moved to take the Customer Engineering position at Diversified Systems, Inc. in 1988, eventually becoming the Senior Customer Engineer. After the facility closed in 2010 Ron began working as a PCB consultant for DIVSYS International. After the merger between DIVSYS and ICAPE, Ron joined the team full-time as USA Technical & Quality Manager.
ICAPE Group is a company that provides access to a network of PCB and technical parts manufacturers with optimized costs, expert engineering advice, short lead times, and sustainable processes.
