About this event
🚀 HDI vs Ultra HDI & IC Substrate PCBs! 🌐
Attention tech enthusiasts! 🤖 The evolution of electronic products is on the fast track, driven by the demand for smaller, lighter, and faster devices with enhanced functionality and disc space.
This trend is steering components towards a lower BGA pitch and increased integration of Components and Printed Circuit Boards. 🔄
Traditional HDI PCB production faces challenges in the era of miniaturization, especially with BGA pitches below 0.4mm. This demands thinner trace & space and smaller holes & pads. Enter the scene: Ultra-HDI PCBs! 🌐
The buzz? The growing demand for integrated solutions with chip direct on PCB, a technology linked to traditional HDI production, famously known as IC Substrate PCB. 💡
Get ready to unlock insights into the world of HDI, Ultra-HDI, and IC Substrate PCBs! ✨
Don't miss out on this educational journey! Register now to grasp the nuances of these 3 HDI-related technologies. 💻
Hosted by
Erik started in the PCB industry in 1989. Starting as a trainee on the production floor, advancing to quality/test and to the pre-production engineering has given him a unique understanding of each production step, combined with theoretical engineering knowledge. This has been the foundation he has used during the years, to be more than just a salesman. For the last 9 years, he has been working as FAE, before he joined ICAPE Group, where he acts as a FAE & Quality Director.
Olivier started working for the PCB industry in 1998. During the first 5 years of his career, he was in charge of the PCB Production Workshop. Then has been Method Manager at SAGEM PCB Manufacture, and as an Application Engineer for Complex & Flex PCB. Since then he is working for ICAPE Group since 2014 as PCB Field Application Engineer.
ICAPE Group is a company that provides access to a network of PCB and technical parts manufacturers with optimized costs, expert engineering advice, short lead times, and sustainable processes.
