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COM-HPC Mini Academy: What’s New in COM-HPC?

About this event

The open and interoperable COM-HPC specification helps satisfy demand for increased compute intelligence in server infrastructure, control endpoints and across edge networking environments. With support for heterogeneous processors up to 150W, an updated high-bandwidth connector, and ample onboard memory capacity, COM-HPC provides a path forward for system architects in need of flexible embedded hardware solutions that will remain relevant for decades.

As AI workloads and IoT platform requirements continue to evolve, COM-HPC   continues to evolve with them. Now with a new compact “Mini” form factor and   updated connector, the potential to support PCI Express Gen 6 and Compute Express   Link 3.1 (CXL 3.1), Functional Safety (FuSa) capability, and more, COM-HPC is ready   for deployment wherever technologists are building the intelligent edge.

This COM-HPC Mini Academy session, brought to you by industry standards   organization PICMG, provides an update on the multi-vendor computer-on-  module specification and how it can transform your edge infrastructure.

Hosted by

  • Team member
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    Brandon Lewis Marketing Officer @ PICMG

    Hi, I'm Brandon. I'm a technical storyteller and integrated marketing strategist currently reimagining tech media and marketing. I'm also the co-marketing officer of leading embedded hardware standards organization, PICMG. Let's talk: https://calendly.com/techielew.

PICMG

PICMG is a not-for-profit consortium of companies and organizations that collaboratively develop open standards for high-performance industrial, military/aerospace, telecommunications, test/measurement, medical, and general-purpose embedded computing a...