Esko invites you to their event

Discover Esko ArtiosCAD: Smarter Structural Packaging Design from Concept to Manufacture

About this event

Explore modern packaging design workflows, new ArtiosCAD capabilities, and real-world insights from a packaging professional at The Hillman Group.

Packaging teams today are under pressure to develop innovative, production-ready packaging faster and more efficiently than ever before

Join this webinar for an introduction to Esko ArtiosCAD and discover how packaging designers, technologists, and engineers use structural design tools to accelerate packaging development, improve accuracy, and streamline collaboration across teams, while maintaining creativity and shelf impact.

During the session, Esko experts will demonstrate core ArtiosCAD capabilities, showcase the latest innovations and newest features, and illustrate how structural design workflows connect with the broader packaging process and Esko ecosystem.

The webinar will also feature customer perspectives from strucural packaging engineering professional at The Hillman Group, sharing practical examples of how he uses ArtiosCAD in real-world packaging development environments, the benefits he has achieved, and lessons learned along the way.

Whether you are new to Esko or looking to get more value from your current packaging workflow, this session will provide practical insights and inspiration for modern structural packaging development.

Key Takeaways:

  • Learn the fundamentals and benefits of Esko ArtiosCAD for structural packaging design
  • See how packaging teams improve speed, accuracy, and efficiency in development workflows
  • Explore the latest ArtiosCAD features and innovations
  • Understand how structural design connects with broader packaging processes and collaboration workflows
  • Hear real-world experiences and best practices from The Hillman Group structural packaging engineer Manager
  • Gain ideas for optimizing packaging development from concept through production

Who should attend:

Packaging professionals across Consumer Goods and Life Sciences industries who want to enhance their expertise in design, engineering, development, and prepress processes.

This webinar is ideal for:

  • Packaging Designers
  • Packaging Engineers
  • Packaging Technologists
  • Prepress Specialists
  • New Product Development (NPD) Representatives

REGISTER NOW!


Hosted by

  • External speaker
    E
    Robin Taylor Pre-Sales Solution Consultant @ Esko

    Prior to joining Esko, Robin's career spanned 25 years working in print, display and packaging. Beginning his early career as a designer, he worked for international packaging groups and independent businesses across a wide range of substrates and formats. His experience as both an advanced ArtiosCAD user and interdisciplinary team leader mean that he can provide Esko's customers with some unique insights, and helpful tips and tricks.

  • External speaker
    E
    Christopher Hoeting The Hillman Group

    Christopher Hoeting is a Packaging Structure Engineering Manager at The Hillman Group with more than 15 years of experience in packaging engineering and product development across retail and ecommerce packaging systems. He holds a Master from University of Maryland and a bachelor’s from University of Dayton. His expertise includes packaging concept development, CAD design, packaging materials and manufacturing processes, packaging validation, and collaboration with global suppliers and cross-functional teams supporting more than 100,000 SKUs. Christopher also has over a decade of experience teaching design, CAD, and manufacturing technologies at institutions including Xavier University and University of Dayton, combining technical engineering knowledge with a strong background in creative problem-solving and innovation.

Esko

Automate, Connect, Accelerate

Esko is a global provider of integrated software solutions that accelerate the go-to-market process of packaged goods. We empower teams to support and manage the end to end packaging design and pre-production processes from Concept to Print.