About this event
Join us for an expert-led webinar exploring the advanced PCB technologies enabling the future of AI-driven systems, from data centers and high-performance computing to next-generation intelligent hardware platforms.
Discover how Ultra HDI and advanced material stack-ups are reshaping PCB design for AI applications:
🔹 Understand the critical role of Ultra HDI (High-Density Interconnect) technologies in supporting compact, high-performance AI architectures.
⚡ Explore the key challenges of designing high-speed, low-loss, high-layer-count PCBs — and why high-precision back-drilling is essential for signal integrity.
🌡️ Learn how advanced material stack-ups improve thermal management, electrical performance, and long-term reliability in AI hardware.
⚙️ Discover the design trade-offs between performance, manufacturability, and cost in next-generation PCB development.
💡 Gain insights from real-world AI, data center, and high-performance computing applications using advanced PCB technologies.
🚀 See how leading engineers are preparing PCB designs for the rapidly evolving demands of artificial intelligence systems.
This webinar gives you a front-row seat to the technologies shaping the next generation of AI electronics — helping you design smarter, faster, and more reliable hardware solutions.
📆 Choose your best webinar session below!
👉 Monday 15 June - 6PM CET
👉 Wednesday 17 June - 3PM CET
👉 Friday 19 June - 10AM CET
Hosted by
Erik started in the PCB industry in 1989. Starting as a trainee on the production floor, advancing to quality/test and to the pre-production engineering has given him a unique understanding of each production step, combined with theoretical engineering knowledge. This has been the foundation he has used during the years, to be more than just a salesman. For the last 9 years, he has been working as FAE, before he joined ICAPE Group, where he acts as a FAE & Quality Director.
ICAPE Group is a company that provides access to a network of PCB and technical parts manufacturers with optimized costs, expert engineering advice, short lead times, and sustainable processes.
