COM-HPC Mini Academy: Helping Technologists Advance Edge Computing for AI, Converged Networks & Beyond

Advances in AI and converged network rollouts mean edge workloads need a sustained balance of high-end compute, low-latency data transmission, and managed power consumption. Business decision makers and system architects deploying these workloads must ensure their edge infrastructure can be implemented quickly, withstand the rigors of field environments, and be upgraded for years or decades to protect investments.

Introduced in 2021, the PICMG COM-HPC family of open and interoperable computer-on-module specifications continues to address these requirements. Now available in a “Mini” form factor; with new features like expanded connectivity support and soldered memory; compatibility with technologies from organizations like the CXL Consortium; and support from dozens of industry suppliers, COM-HPC is equipped for the varied demands of today’s intelligent edge use cases.

Brought to you by industry standards organization PICMG, COM-HPC Mini Academy is a multi-part virtual event that shows you how to take advantage of the next-generation computer on module specification family to bring intelligent edge use cases to life. Event sessions will cover:

• How the new “Mini” form factor brings data center-class performance to mobile-friendly deployments
• How support for CPU, GPU, FPGA, and heterogeneous processor architectures enables flexibility for diverse edge applications
• An updated connector that allows for greater bandwidth and more rugged designs
• Greater bandwidth and lower latency available through potential PCIe Gen 6 support
• Compatibility with Compute eXpress Link (CXL) 3.1 for interoperable high-speed chip-to-memory interconnects
• An updated COM-HPC Mini Carrier Design Guide that streamlines development and deployment of cost-optimized, low-to-mid volume production runs