How to Speed Your Bluetooth LE Design to Mass Production – Reducing Design Barriers with Laird Connectivity & Silicon Labs

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It can be a time consuming, expensive, and iterative process to get the maximum performance and reliability out of your next-generation Bluetooth LE-enabled device. This informative webinar will outline the layers of added value hardware, software and support capabilities that Laird Connectivity has developed into the Silicon Labs EFR32BG22 offering. These capabilities enable OEMs to implement a variety of Bluetooth LE modules into their product development cycle to:

• Reduce their hardware design-in processes
• Enable flexibility and choice in their software development environment
• Limit their certification risk and costs
• Achieve global access to integration support

All of these lead to a significant reduction in overall product development costs, design risks, and a fundamentally faster overall development timeline for your next-generation Bluetooth LE-enabled product.